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  • Submount
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Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
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KO-THF190139 Submount Wire Bonding 2 3.5 3.5 0.3 AlN170 Ni/Pd/Au Metallized 170
KO-THF190142 Submount Wire Bonding 2 3.5 3.5 0.3 AlN170 Ni/Pd/Au Metallized 170
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