Ceramic Packages | Product Information

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Shape
Chip Assembly Method
Number of Terminals
Recommended Chip Size X(Minimum Value)[mm]
Recommended Chip Size X(Maximum Value)[mm]
Recommended Chip Size Y(Minimum Value)[mm]
Recommended Chip Size Y(Maximum Value)[mm]
Recommended Chip Size Z(Maximum Value)[mm]
Package Outer Dimension X[mm]
Package Outer Dimension Y[mm]
Package Thickness[mm]
Material or Material Code
Recommended Lid Thumbnail Number1
Recommended Lid Thumbnail1
Recommended Lid Thumbnail Number2
Recommended Lid Thumbnail2
I/O Pitch[mm]
Lead or Pin
Tie Bar
Lead Bending
Surface Finish
Die Attach Area Surface Finish
Sealing Surface
Thermal Conductivity

Drawing Number	Drawing	Shape	Chip Assembly Method	Number of Terminals	Recommended Chip Size X (Minimum Value)[mm]	Recommended Chip Size X (Maximum Value)[mm]	Recommended Chip Size Y (Minimum Value)[mm]	Recommended Chip Size Y (Maximum Value)[mm]	Recommended Chip Size Z (Maximum Value)[mm]	Package Outer Dimension SizeX[mm]	Package Outer Dimension SizeY[mm]	Package Thickness[mm]	Material or Material Code	I/O Pitch[mm]	Lead or Pin	Tie Bar	Lead Bending	Surface Finish	Die Attach Area Surface Finish	Sealing Surface
KD-83515	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	10	1.3	2.9	1.3	2.9	0.46	6.48	6.48	1.8	A473	1.27	Lead	With Tie Bar	Without Bent Leads		Metallized	Without Seal Ring Metallization
KD-85198-B	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	16	4.1	5.7	2.42	4.02	0.48	10.03	7.29	1.7	A473	1.27	Lead	With Tie Bar	Without Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
KD-F86435-A	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	16	2.19	3.79	1.81	3.41	0.64	9.94	6.91	1.78	A473	1.27	Lead	With Tie Bar	Without Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
KD-F89980-D	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	14	4.48	6.08	1.96	3.56	0.64	9.91	6.48	2.36	A440	1.27	Lead	With Tie Bar	Without Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86651-B	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	16	5.2	6.8	2.33	3.93	0.38	10.45	7.45	1.95	A440	1.27	Lead	With Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86652-C	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	20	5.2	6.8	2.1	3.7	0.46	12.8	7.45	1.95	A440	1.27	Lead	With Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F88151	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	16	5.2	6.8	2.33	3.93	0.64	10.45	7.45	1.95	A440	1.27	Lead	With Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F88152	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	20	5.2	6.8	2.33	3.93	0.64	12.8	7.45	1.95	A440	1.27	Lead	With Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F88154	Drawings Download	SOP (Small Outline Packages)	Wire Bonding	28	5.2	6.8	2.33	3.93	0.64	17.9	7.45	1.95	A440	1.27	Lead	With Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization