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  • RF-VIA Packages
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 Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
Surface Finish		 Sealing Surface
Thermal Conductivity
REFR-A2416-B
Drawings Download
RF-VIA Packages Wire Bonding 24 4.25 5.85 2.3 3.9 0.15 10.21 8.26 0.5 A473 PGMR-A3001
Drawings Download
Lead Without Tie Bar Without Bent Leads Au Cu-Mo With Seal Ring Metallization
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Package

Usage

X
Y
Z

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X 〜

3.8(Minimum Value) to 38.2(Maximum Value)

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Y 〜

3.8(Minimum Value) to 22(Maximum Value)

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0.38(Minimum Value) to 10(Maximum Value)

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2.4(Minimum Value) to 100(Maximum Value)

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5(Minimum Value) to 50(Maximum Value)

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Lid

X 〜

1.07(Minimum Value) to 40.64(Maximum Value)

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Y 〜

0.87(Minimum Value) to 38(Maximum Value)

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〜

0.04(Minimum Value) to 4.06(Maximum Value)

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Please enter more than 2 digits of number or alphabet in drawing number. Only dash "-" can be used besides number or alphabet.

Please enter more than 2 digits of number or alphabet in drawing number. Only dash "-" can be used besides number or alphabet.