Results for
  • QFP (Quad Flat Packages)
1results

* Membership registration (login) is required to download drawings.

Results per page
Change Columns
Appearance
Drawing Number
Drawing Shape Chip Assembly Method
Number of Terminals
Recommended
Chip Size X
(Minimum Value)[mm]
Recommended
Chip Size X
(Maximum Value)[mm]
Recommended
Chip Size Y
(Minimum Value)[mm]
Recommended
Chip Size Y
(Maximum Value)[mm]
Recommended
Chip Size Z
(Maximum Value)[mm]
Package
Outer Dimension
SizeX[mm]
Package
Outer Dimension
SizeY[mm]
Package
Thickness[mm]
Material or
Material Code
Recommended Lid
Thumbnail Number1
Recommended
Lid
Thumbnail1
Recommended Lid
Thumbnail Number2
Recommended
Lid
Thumbnail2
I/O
Pitch[mm]
Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
Surface Finish
Sealing Surface
Thermal Conductivity
PB-F86259-A QFP (Quad Flat Packages) Wire Bonding 132 9.43 11.03 9.43 11.03 0.51 24.13 24.13 1.91 A440 0.64 Lead With Tie Bar Without Bent Leads Ni/Au Metallized With Seal Ring Metallization
1results
Results per page
Page 1 of 1

* The appearance is an image. It may differ from the actual content.

* PDF file size is 19-2,500KB.

0Drawing Number Selected