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  • QFN(Quad Flat Non-Leaded Packages)
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Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
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KD-DA6K98 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.4 10 10 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA6L79 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 64 8.5 10.1 8.5 10.1 0.4 13 13 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA6L81 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 32 3.5 5.1 3.5 5.1 0.4 8 8 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA6L83 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 28 2 3.6 2 3.6 0.4 6.5 6.5 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA7069 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 8.62 10.22 8.62 10.22 0.57 14.22 14.22 1.65 A440 1.02 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA7863 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 32 4.73 6.33 4.73 6.33 0.57 10.67 10.67 1.65 A440 1.02 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DA9L09-B QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 8.62 10.22 8.62 10.22 0.5 14.22 14.22 1.5 A440 1.02 Ni/Au Metallized With Seal Ring Metallization
KD-DB0457 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 6.5 8.1 6.5 8.1 0.7 10 10 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0A91 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.5 11 11 1.5 A440 0.8 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0D16 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 52 7 8.6 7 8.6 0.3 11 11 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0G13 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.7 7.3 5.7 7.3 0.4 10 10 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0G16 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 64 8.7 10.3 8.7 10.3 0.4 13 13 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0G18 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 28 2.2 3.8 2.2 3.8 0.4 6.5 6.5 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0G21 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 32 3.7 5.3 3.7 5.3 0.4 8 8 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0H03 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 6 7.6 6 7.6 0.5 11 11 1.5 A440 0.8 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0H05 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 52 6 7.6 6 7.6 0.3 11 11 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0H71 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 56 7 8.6 7 8.6 0.3 12 12 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0K65 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 84 15.78 17.38 15.78 17.38 0.51 29.21 29.21 2.03 A440 1.27 Ni/Au Metallized Without Seal Ring Metallization
KD-DB0N59 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.5 11 11 1.5 A440 0.8 Ni/Au Metallized With Seal Ring Metallization
KD-DB1265 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.4 10 10 1 A440 0.7 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB1270 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 64 11.4 13 11.4 13 0.5 18 18 1.5 A440 1 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB1M51-B QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 8.62 10.22 8.62 10.22 0.5 14.22 14.22 1.5 A440 1.02 Ni/Au Metallized With Seal Ring Metallization
KD-DB1N95 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 16 1 2.6 1 2.6 0.3 6 6 1 A440 1 Ni/Au Metallized Without Seal Ring Metallization
KD-DB2023 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.4 10 10 1 A440 0.7 Ni/Au Without Metallization With Seal Ring Metallization
KD-DB2528 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 32 3.5 5.1 3.5 5.1 0.4 8 8 1 A440 0.7 Ni/Au Without Metallization With Seal Ring Metallization
KD-DB2B73 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 48 5.5 7.1 5.5 7.1 0.4 10 10 1.3 A440 0.7 Ni/Au Metallized Without Seal Ring Metallization
KD-DB3666 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 64 8.5 10.1 8.5 10.1 0.4 13 13 1.3 A440 0.7 Ni/Au Metallized Without Seal Ring Metallization
KD-DB3693 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 32 4.73 6.33 4.73 6.33 0.57 10.67 10.67 1.65 A440 1.02 Ni/Au Metallized Without Seal Ring Metallization
KD-DB3K70 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 40 5.27 6.87 5.27 6.87 0.8 10.16 10.16 1.6 A440 0.85 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB5676 QFN(Quad Flat Non-Leaded Packages) Wire Bonding 28 2 3.6 2 3.6 0.4 6.5 6.5 1 A440 0.7 Ni/Au Without Metallization With Seal Ring Metallization
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