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Shape
Chip Assembly Method
Number of Terminals
Recommended Chip Size X(Minimum Value)[mm]
Recommended Chip Size X(Maximum Value)[mm]
Recommended Chip Size Y(Minimum Value)[mm]
Recommended Chip Size Y(Maximum Value)[mm]
Recommended Chip Size Z(Maximum Value)[mm]
Package Outer Dimension X[mm]
Package Outer Dimension Y[mm]
Package Thickness[mm]
Material or Material Code
Recommended Lid Thumbnail Number1
Recommended Lid Thumbnail1
Recommended Lid Thumbnail Number2
Recommended Lid Thumbnail2
I/O Pitch[mm]
Lead or Pin
Tie Bar
Lead Bending
Surface Finish
Die Attach Area Surface Finish
Sealing Surface
Thermal Conductivity

Drawing Number	Drawing	Shape	Chip Assembly Method	Number of Terminals	Recommended Chip Size X (Minimum Value)[mm]	Recommended Chip Size X (Maximum Value)[mm]	Recommended Chip Size Y (Minimum Value)[mm]	Recommended Chip Size Y (Maximum Value)[mm]	Recommended Chip Size Z (Maximum Value)[mm]	Package Outer Dimension SizeX[mm]	Package Outer Dimension SizeY[mm]	Package Thickness[mm]	Material or Material Code	I/O Pitch[mm]	Lead or Pin	Tie Bar	Lead Bending	Surface Finish	Die Attach Area Surface Finish	Sealing Surface
PB-F86074	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	84	5.62	7.22	5.62	7.22	0.38	29.21	29.21	1.65	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86079	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	44	4.35	5.95	4.35	5.95	0.51	16.51	16.51	1.65	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86090-A	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	44	5.62	7.22	5.62	7.22	0.51	16.51	16.51	1.65	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86315	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	44	6.64	8.24	6.64	8.24	0.64	16.51	16.51	1.78	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86320-A	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	68	5.62	7.22	5.62	7.22	0.51	24.13	24.13	2.03	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86635	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	68	9.94	11.54	9.94	11.54	0.51	24.13	24.13	2.03	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F86767	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	44	6.64	8.24	6.64	8.24	0.64	16.51	16.51	1.78	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F87048	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	28	4.1	5.7	4.1	5.7	0.51	11.43	11.43	1.52	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F87049	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	44	9.18	10.78	9.18	10.78	0.64	16.51	16.51	1.78	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization
PB-F88345	Drawings Download	QFJ (Quad Flat J-Leaded Packages)	Wire Bonding	28	5.37	6.97	5.37	6.97	0.51	12.04	12.04	2.03	A440	1.27	Lead	Without Tie Bar	With Bent Leads	Ni/Au	Metallized	With Seal Ring Metallization