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Shape
Chip Assembly Method
Number of Terminals
Recommended Chip Size X(Minimum Value)[mm]
Recommended Chip Size X(Maximum Value)[mm]
Recommended Chip Size Y(Minimum Value)[mm]
Recommended Chip Size Y(Maximum Value)[mm]
Recommended Chip Size Z(Maximum Value)[mm]
Package Outer Dimension X[mm]
Package Outer Dimension Y[mm]
Package Thickness[mm]
Material or Material Code
Recommended Lid Thumbnail Number1
Recommended Lid Thumbnail1
Recommended Lid Thumbnail Number2
Recommended Lid Thumbnail2
I/O Pitch[mm]
Lead or Pin
Tie Bar
Lead Bending
Surface Finish
Die Attach Area Surface Finish
Sealing Surface
Thermal Conductivity

Drawing Number	Drawing	Shape	Chip Assembly Method	Number of Terminals	Recommended Chip Size X (Minimum Value)[mm]	Recommended Chip Size X (Maximum Value)[mm]	Recommended Chip Size Y (Minimum Value)[mm]	Recommended Chip Size Y (Maximum Value)[mm]	Recommended Chip Size Z (Maximum Value)[mm]	Package Outer Dimension SizeX[mm]	Package Outer Dimension SizeY[mm]	Package Thickness[mm]	Material or Material Code	I/O Pitch[mm]	Lead or Pin	Surface Finish	Die Attach Area Surface Finish	Sealing Surface
KD-84090-A	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	84	9.18	10.78	9.18	10.78	0.51	27.94	27.94	2.03	A440	2.54	Pin	Au	Metallized	With Seal Ring Metallization
KD-84838-B	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	84	8.16	9.76	8.16	9.76	0.51	27.94	27.94	2.03	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P83560-D	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	132	9.43	11.03	9.43	11.03	0.64	35.56	35.56	2.29	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P85311-A	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	84	9.94	11.54	9.94	11.54	0.51	27.94	27.94	2.03	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P85B54-B	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	84	8.16	9.76	8.16	9.76	0.64	27.94	27.94	2.16	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P86499-B	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	145	15.78	17.38	15.78	17.38	0.51	40.01	40.01	2.03	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P86755	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	68	5.39	6.99	5.39	6.99	0.64	27.89	27.89	1.91	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P87350	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	132	6.89	8.49	6.89	8.49	0.64	35.56	35.56	2.29	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P87421-A	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	84	6.89	8.49	6.89	8.49	0.64	27.94	27.94	2.16	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization
KD-P87465-A	Drawings Download	PGA (Pin Grid Array Packages)	Wire Bonding	68	6.89	8.49	6.89	8.49	0.64	27.94	27.94	2.16	A440	2.54	Pin	Ni/Au	Metallized	With Seal Ring Metallization