Results for
  • LandGridArray®
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Drawing Shape Chip Assembly Method
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(Minimum Value)[mm]
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I/O
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Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
Surface Finish
Sealing Surface
Thermal Conductivity
KD-DB0N53 LandGridArray® Wire Bonding 100 7 8.6 7 8.6 0.3 11 11 1 A440 1 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB0R81 LandGridArray® Wire Bonding 96 7 8.6 7 8.6 0.3 11 11 1 A440 1 Ni/Au Without Metallization Without Seal Ring Metallization
KD-DB2144 LandGridArray® Wire Bonding 96 7 8.6 7 8.6 0.3 11 11 1 A440 1 Ni/Au Without Metallization With Seal Ring Metallization
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