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  • Flat Packages
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 Drawing Shape Chip Assembly Method
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Chip Size X
(Minimum Value)[mm]
Recommended
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(Maximum Value)[mm]
Recommended
Chip Size Y
(Minimum Value)[mm]
Recommended
Chip Size Y
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Recommended
Chip Size Z
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 Lead or Pin Tie Bar Lead Bending Surface Finish Die Attach Area
Surface Finish		 Sealing Surface
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KD-77321-A
Drawings Download
Flat Packages Wire Bonding 44 24.49 26.09 25.99 27.59 1.02 35.5 32.51 3.05 A473 1.27 Lead With Tie Bar Without Bent Leads Ni/Au Without Metallization With Seal Ring
KD-H85210-E
Drawings Download
Flat Packages Wire Bonding 30 18.32 19.92 18.19 19.79 0.51 28.7 23.83 2.37 A473 1.27 Lead With Tie Bar Without Bent Leads Ni/Au Without Metallization With Seal Ring
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Package

Usage

X
Y
Z

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〜

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X 〜

3.8(Minimum Value) to 38.2(Maximum Value)

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Y 〜

3.8(Minimum Value) to 22(Maximum Value)

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0.38(Minimum Value) to 10(Maximum Value)

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2.4(Minimum Value) to 100(Maximum Value)

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5(Minimum Value) to 50(Maximum Value)

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Lid

X 〜

1.07(Minimum Value) to 40.64(Maximum Value)

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Y 〜

0.87(Minimum Value) to 38(Maximum Value)

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〜

0.04(Minimum Value) to 4.06(Maximum Value)

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Please enter more than 2 digits of number or alphabet in drawing number. Only dash "-" can be used besides number or alphabet.

Please enter more than 2 digits of number or alphabet in drawing number. Only dash "-" can be used besides number or alphabet.